ملخص: Microwave integrated circuits (MIC's) and high frequency digital circuits (HFDC's) have reached a high degree of complexity arising essentially from increasing integrations levels and the use of multilayer parallel and crossing microstrip interconnections as well as arbitrary shaped metalizations on different interfaces of isotropic and anisotropic dielectric substrates. Presently, taking into account the constraints in MIC's dimensions, CAD tools are necessary to optimize the coupling capacitances and inductances between conductors as well as the fringing capacitances occuring on the metalization discontinuities. In our work, we have applied the method of lines to develop a software program to analyze, in quasi-static approach, some microwave structure and components. The method of lines was selected because of its numerous advantages among them the suitability to deal with complex microwave structures, no relative convergence problem, low memory space requirement and no spurious physical rsults. We have extended the application of this method to two layers of parallel conductors, isolated crossing conductors as well as rextangular and open-end microstrips with vanishing thickness deposited on anisotropic dielectric substrates of saphire. The results agree well with theoretical predictions and published data where more complex mathematical approaches have been used...

طبعة: Boumerdes: National Institute of Electricity and Electronics
لغة: إنجليزية
الوصف المادي: 94 p. ill. ;30 cm
الشهادة: Magister
مؤسسة مناقشة الرسالة: National Institute of Electricity and Electronics

ملاحظة: Bibliogr.pp.88-91; Annexe pp.92-94